• Material Used Polyimide
• Maximum Panel Size 19.7” x 24” (500 mm x 610 mm)
• Line width & Spacing 3mil (0.075 mm)
• Copper thickness 1/3 oz Min.
• Layer to Layer Registration ± 5mil (0.13 mm)
• Via / Drill Size
Minimum Drill Hole Diameter PTH 8 mil (0.2 mm)
Minimum Via Size 4 mil (0.1 mm)
• Lands / Pads 20 mil (0.5 mm)
• Surface Finish
Hard Gold / Immersion Gold / HAL / Tin Lead Plating / Tin Plating
· Cover layer PI., Flexible Solder Mask
· Stiffener material PI., PE.,FR4, and metal
· Shielding material Copper, Silver foil, Silver Paste
· Flex with Assembly ( Through-hole and SMT): 0201 component, 0.4 mm pitch IC