qDepth-drilling +/- 10 µm (microns)
qDrilling (X-Ray)
qMin. IL thickness 0.063 mm
qImpedance controlled PCB's
qSequential laminated products (Build-up)
qMinimal grid of testing points 50 µm (microns)
Min. detectable defect size 0.035 mm
qTrack width IL 35 µm (microns)
qSpacing IL 35 µm
qTrack width OL 35 µm
qSpacing OL 35 µm
qLaser drilling, minimum drill 0.05 mm
qAspect ratio 12:1
qSurface: Electrolytic Sn,Ni/Au, Immersion Ni/Au,Immersion Sn etc.