TECHNOLOGY PARAMETER OF PC Boards
Feature | Year 2007 |
| Monthly Production Capacity | 2,100,000Sq.ft |
| Layer(Mass Production) | 2-36 Layers |
| Impedance Control | +8% |
| Minimum Thickness of CCL | 3.5mil(including copper) |
| Board Thickness | 6-240mil |
| Copper Clad Laminate | FR4 & Halogen Free & CEM-3 &
FR5 & PTFE & Rogers & Getek &
BT & Polyimide FR4(Dciyfree) |
| Inner Etching | Min.Line/Space | 3.5mil(A/W) |
| Line Width tolerance | +10% |
| Board Thickness(Min.) | 3.5mil(including copper) |
| Plating Hole | Min.Hole Size | 6mil |
| Aspect Ratio(max) | 8 |
| Position Accuracy | +1.5mil |
| Microvia | Min Hole Size | 4mil |
| Aspect Ration(max) | 1:1 |
| Outer Etching | Min.Line Width/Space | 3.5/3.5mil(A/W) |
| Line Width tolerance | +0.35mil |
| Solder Mask | Bridge | 3mil |
| Position Accuracy | 1.5mil |
| Press | Thickness tolerance | 10% |
| Wrap/Twist | 0.75% |
| Inner Opening(min) | (1)4/L:6mil |
| (2)6/L-8/L:7mil |
| (3)8/L or above:8mil |
Lead Time |
| | Mass Production | Prototype & Hot Item |
| Double-sided | 10 days | 2-3 days |
| Multi-layer | 2 weeks | 3-6 days |
Web:
www.wwteq.com Email: sales@winwincircuit.com