Layers (2-38)
Lines and Spaces (Volume 3/3 Prototype 2.5/2.5)
Controlled Impedance (+/- 10% Standard)
Blind and Buried Vias
Microvias ,Laser Drill
Backpanels (up to 1 inch thick)
MCM/Substrates
High Performance and Emerging Materials
Sequential Lamination
Micro BGA ,BGA Plug
Finishing:HAL,Entek(OSP),Gold Finger,Flash Gold, Immersion Gold,Immersion Tin, Immersion Silver
Special PCBs
Heavy Copper PCBs |