Layers (2-38)
Lines and Spaces (Volume 3/3 Prototype 2/2)
Controlled Impedance (+/- 10% Standard)
Blind and Buried Vias
Microvias
MCM/Substrates
High Performance and Emerging Materials
Sequential Lamination
Micro BGA
Ultra Fine Pitch
Finishing:HAL,HAL LF,Entek,Gold Finger,Flash Gold,Entek,ImmersionGold,Immersion Silver,Immersion Tin |