New Laminates(Rogers)

New Laminates(Rogers)

Friday, July 24, 2009 | Rogers Corporation

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The Advanced Circuit Materials(ACM) Division of Rogers Corporation recently introduced RO4730™LoPro™ laminates for base station, RFID and other antenna designs.RO4730 LoPro laminate materials combine low-loss dielectric withlow-profile copper foil for reduced passive intermodulation (PIM)and low insertion loss. The specially formulated RO4730 LoProthermoset resin system incorporates a hollow microsphere filler toachieve a low weight, light density laminate, which isapproximately 30% lighter weight than woven-glass PTFE materials.RO4730 LoPro laminates have a matched dielectric constant of 3.0,providing a much lower cost solution for high frequency circuitboards used in base station and otherantennas.

RO4730 LoProlaminates feature low Z-axis coefficient of thermal expansion (CTEof about 40 PPM/ºC) for design flexibility. With a temperaturecoefficient of dielectric constant of about 23 PPM/ºC, thelaminates provide consistent circuit performance over short termtemperature ranges. They feature the same high glass transitiontemperature (Tg) as Rogers' other high-performance RO4000®laminates, greater than 280ºC, making them lead-free and automatedassembly compatible.

RO4730 LoProRoHS-compliant laminates are compatible with standard PCBfabrication techniques and plated-through-hole (PTH) processing.Designed for base station and other RFID antennas, the proprietary,halogen-free laminates support longer drill tool lifetimes thanother filled materials, reducing fabrication costs.

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